Product Description
"Complete dependence on semiconductor vendors' application notes and data sheets is now a thing of the past thanks to this all-in-one comparison text on nonvolatile semiconductor memory (NVSM) technology. Working electronics engineers can now refer to this book to access the technical data and applications-focused perspective they need to make intelligent decisions regarding the selection, specification, procurement, and application of NVSM devices.

The most comprehensive book in the field, NONVOLATILE SEMICONDUCTOR MEMORY TECHNOLOGY gathers expertly-written information scattered throughout device literature in a single, well-balanced volume. This book features an in-depth overview accompanied by applications-oriented chapters on device reliability and endurance, radiation tolerance, as well as device physics and design. It is an essential reference for electronics engineers."

Sponsored by:
IEEE Components, Packaging, and Manufacturing Technology Society, IEEE Solid-State Circuits Council/Society. ... Read more

Customer Reviews (1)

NV Memory Technology book review
This book is one of the most comprehensive sources available for information on non-volatile memory ICs. The subject material gives in-depth coverage of EPROM, EEPROM and FLASH design, fabrication and reliability issues.The information is extremely well-organized, thorough andpractical and was obviously written by practicing professionals as opposedto academia. The illustrations are numerous and excellent. Numerousreferences are cited as sources for additional information. This is NOT oneof those technical books which is merely a collection of published aricles.The authors obviously established a structure of relevant topics prior todeveloping their subjects and choosing their reference sources. The weakestareas of the book were test and ultra low power NV design. ... Read more

Product Description
This volume offers a solid foundation for understanding the most important devices used in the hottest areas of electronic engineering today, from semiconductor fundamentals to state-of-the-art semiconductor devices in the telecommunications and computing industries. Kevin Brennan describes future approaches to computing hardware and RF power amplifiers, and explains how emerging trends and system demands of computing and telecommunications systems influence the choice, design, and operation of semiconductor devices. In addition, he covers MODFETs and MOSFETs, short channel effects, and the challenges faced by continuing miniaturization. His book is both an excellent senior/graduate text and a valuable reference for practicing engineers and researchers. ... Read more

Product Description
Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control. ... Read more

Customer Reviews (2)

Run-to-Run Control Explained
Run-to-Run (R2R) control is a process control technique for batch-processing environments in which an algorithm is used to adjust process parameters prior to each batch (run). Information from previous runs, prior process inputs, or environmental information might all play a part in the control algorithm. The authors make a convincing point that run-to-run control has been very successful and has widespread application in the semiconductor industry, and is, in fact, "the least equipment-invasive control scheme that demonstrates real benefit."

This book is not a loose collection of case studies or a group of unrelated articles; it is, rather, a complete and integrated treatment of the subject of run-to-run control in its present state of development. The technical content exhibits the benefit of years of research through [the semiconductor research consortium] Sematech and excellent scholarship with over 300 references included. Both the theory of run-to-run control and the realities of implementation in modern manufacturing environments are covered.

[Excerpted with permission from review to appear in Journal of Quality Technology]

Run-to-Run Control in Semiconductor Manufacturing
Having only recently gained significant acceptance in the semiconductor industry, run-to-run (R2R) control has been shown to be a highly effective method for minimizing the influence of systematic variations on the performance of semiconductor manufacturing equipment. Consequently, this book should prove to be a timely and welcome addition to the library of any manufacturing technologist in the semiconductor industry. Intended for use by novices as well as experts, it covers both the theory and application of R2R control in the semiconductor industry. Written by contributors from both industry and academia, the book is organized into seven topical sections.For the benefit of readers new to the subject, each section is arranged so that the first few chapters in the section are introductory in nature.

The book begins with an historical overview of process control in the semiconductor industry and the reasons why R2R control has emerged as one of the key process control technologies in use in the industry today.The rest of the section traces the evolution of R2R control in the semiconductor industry, including the barriers to its implementation and the enabling technologies that have helped to overcome these barriers, and provides a brief introduction to R2R control and process optimization methods.

The second section of the book focuses on control algorithms and the application of these algorithms to R2R process optimization and control. Particular attention is paid to R2R algorithms based on the exponentially weighted moving average (EWMA) statistic such as the "gradual mode" and the "predictor-corrector" controllers. A significant advantage of these EWMA algorithms is that they are relatively easy to implement and they have been shown to work well for a variety of applications in the semiconductor industry. The rest of the section is devoted to several adaptive algorithms that can be used for both process optimization and control.The last chapter compares the performance of the R2R algorithms discussed in the previous chapters under a variety of conditions for both linear and non-linear processes.It should prove quite helpful to anyone trying to evaluate R2R control strategies.

The third section addresses the role of integration and automation in implementing R2R control in manufacturing environments.These are key enablers for R2R control and, as the authors note, if careful consideration is not given to them when implementing R2R control systems the solutions developed could turn out to be too costly or cumbersome to be useful.Because integration and automation span such a wide domain of technologies and disciplines, standards are absolutely vital to its success.Fortunately the first chapter in this section provides a thorough review of integration and automation standards that have been developed and proposed by organizations like SEMATECH, SEMI, and SIA.The subsequent chapters in this section address specific implementations of R2R control and the integration and automation strategies used with these implementations.A minor criticism of this section is the emphasis in these chapters on the Generic Cell Controller (GCC), although it should be noted that the authors have a wealth of experience with the application of the GCC to R2R control. The remaining sections of the book cover case studies of the application of R2R control to specific semiconductor manufacturing processes like Chemical Mechanical Polishing (CMP) and photolithography and advanced topics such as methods for dealing with process upsets and control strategies that span multiple process technologies.The book concludes with a discussion of the future of R2R control in semiconductor manufacturing and suggestions for further reading which are in addition to the thorough list of references included at the end of each chapter of the book.

In conclusion, this book is a very useful reference for any manufacturing technologist in the semiconductor industry.It provides a good introduction to the basics of R2R control and illustrates its application to semiconductor manufacturing with specific examples and case studies based on the authors personal experiences. ... Read more

Product Description

This is a unique book devoted to the important class of both oxide and nitride semiconductors. It covers processing, properties and applications of ZnO and GaN. The aim of this book is to provide the fundamental and technological issues for both ZnO and GaN. Materials properties, bulk growth, thin and thick films growth, control of polarity and application, nonpolar growth, structural defects, optical properties, electrical properties, nanostructures and the applications, and light emitters based on GaN and ZnO are treated succinctly. The unique format of touching both materials in each chapter enables this book to be very fresh, essential, and easy-to-access for readers who have interests in, and need getting more involved with, the most exciting compound semiconductors, ZnO and GaN

Product Description

Using the continuum of interface-induced gap states (IFIGS) as a unifying theme, Mönch explains the band-structure lineup at all types of semiconductor interfaces. These intrinsic IFIGS are the wave-function tails of electron states, which overlap a semiconductor band-gap exactly at the interface, so they originate from the quantum-mechanical tunnel effect. He shows that a more chemical view relates the IFIGS to the partial ionic character of the covalent interface-bonds and that the charge transfer across the interface may be modeled by generalizing Pauling?s electronegativity concept. The IFIGS-and-electronegativity theory is used to quantitatively explain the barrier heights and band offsets of well-characterized Schottky contacts and semiconductor heterostructures, respectively.

Product Description
For courses in Semiconductor Manufacturing Technology, IC Fabrication Technology, and Devices: Conventional Flow.This up-to-date text on semiconductor manufacturing processes takes into consideration the rapid development of the industry's technology. It thoroughly describes the complicated and new IC chip fabrication processes in detail--with minimum mathematics, physics, and chemistry. Advanced technologies are covered along with older ones to assist students in understanding the development processes from a historic point of view. ... Read more

Customer Reviews (2)

A good introductory book
This is a good entry-level book written in an easy tone, the author is currently giving lecture in China.
The whole book uses less than ten equations, however, this is the point that anyone with any background can read through this book without difficulties.

A job-saver!!!
I started a job as a technical writer at a semiconductor company in April, 2002. A couple weeks later, I bought this book because I didn't totally understand what the industry was all about. It has really taught me everything I needed to know about the semiconductor industry, and the role my company's products play in it.

The reason I give it 4 stars is because at one (early) point the book says "this is the hardest math in this book," which just isn't true. However, anyone who passed high school algebra 2 will be able to do the rest of the math in the book, or you can skip it if you're not looking for a math/science lesson.

If you are learning about semiconductors for a job, or you are starting an academic program in semiconductor engineering, this is a terrific book. I don't know if experienced engineers will find it useful, as I'm not an experienced engineer. Every new tech writer to come into the company has also borrowed this book during the first couple of weeks, just to help them get into the swing of things. ... Read more

Product Description

The state-of-the-art of quantum transport and quantum kinetics in semiconductors, plus the latest applications, are covered in this monograph. Since the publishing of the first edition in 1996, the nonequilibrium Green function technique has been applied to a large number of new research topics, and the revised edition introduces the reader to many of these areas. This book is both a reference work for researchers and a self-tutorial for graduate students.

Customer Reviews (2)

Good book
This is a good book, but exorbitantly expensive. check it out from your library, unless you're surrounded by Green's functions aficionados you shouldn't have a problem finding a copy.
Two things though - the second version isn't as updated as I would have liked - there's a rather scant discussion of molecular electronics that should have been more in-depth for example.
There are several typos left uncorrected as well - for example mistakes in equations 3.62 and 4.5 to name a few....
But all in all, the best discussion in book form of the Keldysh (non-equilibrium) technique. Its either this or a bunch of monographs with ugly typesettings from the 80s... deal!

A very useful book on Keldysh techniques
I recommend this book to anyone who wants an introduction to nonequilibrium Green function techniques.It is much more readible and up-to-date than Kadanoff and Baym's "Quantum StatisticalMechanics". ... Read more

Product Description
Plasma processing is a central technique in the fabrication of semiconductor devices. This self-contained book provides an up-to-date description of plasma etching and deposition in semiconductor fabrication. It presents the basic physics and chemistry of these processes, and shows how they can be accurately modeled. The author begins with an overview of plasma reactors and discusses the various models for understanding plasma processes. He then covers plasma chemistry, addressing the effects of different chemicals on the features being etched. Having presented the relevant background material, he then describes in detail the modeling of complex plasma systems, with reference to experimental results. The book closes with a useful glossary of technical terms. No prior knowledge of plasma physics is assumed in the book. It contains many homework exercises and serves as an ideal introduction to plasma processing and technology for graduate students of electrical engineering and materials science. It will also be a useful reference for practicing engineers in the semiconductor industry. ... Read more

Customer Reviews (2)

Excellent resource for plasma physics
This book is an excellent tool for understanding the fundamental phenomenon that occur inside low density plasmas commonly used for semiconductor fabrication.

Plasma Processes for Semiconductor Fabrication
This book is outstanding if you are interested in a great deal of plasma physics.If you are looking for information regarding device processing, I think that the book does not offer too much.However, there is someinformation on Si processing specifically. ... Read more

Product Description

The First Comprehensive, Example-Rich Guide to Power Integrity Modeling

Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.

The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

The authors

• Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
• Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
• Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
• Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
• Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures

This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Customer Reviews (2)

Foremost and Authoritative book on Power Integrity
Although lot has been written about Signal Integrity (SI), hardly any book is available for Power Integrity (PI) except for research papers. However, recent high speed interfaces such as DDR memories and faster GHz processors pose enormous power integrity challenges. A timely and most authoritative book on this subject is "Power Integrity Modeling and Design for Semiconductors and Systems" by Prof. Madhavan Swaminathan and Dr. Ege Engin of Packaging Research Centre (PRC), Georgia Tech. , USA.

The book captures key results of the power integrity research particularly in the last 5 years and shows how these results can be applied to solve complex off-chip power integrity problems in practice. It also provides in depth understanding of algorithms specifically developed for power integrity model extraction and analysis. Besides R&D, understanding these algorithms and methods would also help to make judicious investments on appropriate tools for power integrity analysis. Analysis of power integrity issues and solutions on some of the leading designs from companies such as Sun Microsystems, IBM and Rambus is of great value addition in this book. What's more, authors also provide a freely downloadable tool developed at PRC, Georgia Tech. for power integrity modeling. Examples discussed in this book can be easily tried with this simulator.

The book is organized in to 5 chapters. The chapter 1 explains the fundamental concepts behind origin, modeling, design and analysis of power integrity effects. It also briefly discusses the techniques for high frequency power-ground impedance measurements. The concepts of self and transfer impedances are also dealt in this chapter. Additionally a methodology for power integrity modeling is presented which forms the basis for subsequent chapters.

The chapter 2 discusses the modeling of power and ground planes with both lumped and distributed circuit approaches.Some of the topics covered are Transmission Matrix Method (TMM), Finite Difference Method (FDM), Finite Difference Time Domain Method (FDTD), Finite Element Method (FEM) and cavity resonators. It also discusses in detail coupling of multiple plane pairs through vias and apertures.

The chapter 3 is all about Simultaneous Switching Noise (SSN). The challenge for SSN analysis is to model complex interaction between transmission lines and plane pairs. A modal decomposition method is introduced for the SSN analysis of plane pairs acting as return path for transmission lines. Applicability of developed SSN model in both time and frequency domains are analyzed. Case study of a complex board analysis using modeling approach developed is also included.

The chapter 4 discusses time domain simulation methods such as rational function method, Signal Flow Graphs (SFG) and Modified Nodal Analysis (MNA). These simulation methods provide time domain waveforms from frequency response captured through S-parameters or other equivalent parameters. The results derived in this chapter show why co-simulation of signal and power integrity effects is required and how this can be done using the simulation methods described. The importance of causality and passivity enforcement are illustrated through practical examples. Thevarious time domain simulation methods are also compared.

The chapter 5 provides case studies of power integrity issues in packages and PCBs in leading industrial designs. Other topics covered are test structures for extraction of material properties, embedded decoupling capacitors and Electronic Band Gap (EBG) structures. Accurate extraction of dielectric material properties such as loss tangent and dielectric constant is essential for accurate power and signal integrity modeling. This material property extraction is always a challenge. The authors however describe a simple yet powerful test setup to accurately extract material properties for broad range of frequencies. Embedded decoupling capacitors are an emerging technology to suppress power supply noise and this is dealt in detail. The EBGs are a novel passive filter structure exploited to provide power supply noise isolation between sensitive analog blocks (ex. LNAs, ADC) and noisy digital circuits. This chapter provides an excellent understanding of modeling and design methods for EBG structures with practical examples.

The methods described in the above chapters were validated using a combination of measurements and full wave EM solver analysis. The book also provides complete details on the fabricated test structures for validation. Figures that illustrate the concepts in this book are so captivating that they more or less need no explanation. Although this book provides a complete picture of power integrity like that of a text book it lacks student problems to reinforce understanding. Nevertheless this is an invaluable book for students stepping in to the world of signal and power integrity, experienced professionals involved in high speed design and for all those developing signal and power integrity tools.

Great book covering the power integrity issue of package
At first, I was looking for a book covering on-chip power integrity issue and happened to find this book on Amazon. Since I can not search inside this book, I just bought it and later found it is related to the power integrity of package, not chip. However, I DEFINITELY don't regret buying this book because it covers one of the important pieces in the design of power distribution network.

After reading chapter 1, I realize that the power integrity issue should be attacked from a system point of view, including chip, package and board. Only considering on-chip power integrity is not enough because the power supply is located on the board and electrically far away from the chip. The important concept of target impedance is also introduced and really opens my mind on how to design a robust power distribution network.

Chapter 2 covers the modeling of power/ground planes in high performance package and board. Two novel modeling methods, transmission matrix method and cavity-model method are desrcibed in detail here. The major advantages of the two methods over full wave methods, like FDTD and FEM, are ease of integrating into circuit simulators.

Chapter 3 covers the topic of simultaneous switching noises. The signal nets are modeled as uncoupled microstrip and strip transmission lines. The coupling effects between signals and power/ground planes are modeled as controlled sources, which are obtained by mode decomposistion methods. Then, the uncoupled transmission lines and controlled sources are integrated with the power/ground plane models from chapter 2 to conduct simultaneous switching noise analysis.

Chapter 4 introduces time-domain simulations of power distribution networks. The major foucs is how to incorporate s-parameter data into time-domain circuit simulators. The techniques like vetor fitting, passivitiy enforcement by Hamiltonian matrix , signal flow method, and MNA with s-parameter are explained and compared.

Chapter 5 applies the modeling and analysis methods from previous chapters to real applications. Great insight is learned from these real world problems.

I strongly recommend this book to the designers and CAD tool developers of power distribution networks. Since the major focus of this book is package power, I also recommend two other books which cover board and on-chip power integirty issue respectively:

"Frequency-Domain Characterization of Power Distribution Networks" by Istvan Novak and Jason R. Miller

"Power Distribution Networks with On-Chip Decoupling Capacitors" by Mikhail Popovich, Andrey V. Mezhiba, and Eby G. Friedman
... Read more

Product Description
"Semiconductor Quantum Dots" presents an overview of the background and recent developments in the rapidly growing field of ultrasmall semiconductor microscrystallites, in which the carrier confinement is sufficiently strong to allow only quantized states of the electrons and holes. The main emphasis of this book is the theoretical analysis of the confinement induced modifications of the optical and electronic properties of quantum dots in comparison to extended materials. The book develops the theoretical background material for the analysis of carrier quantum-confinement effects, it introduces different confinement regimes for absolute or center-of-mass motion quantization of the electron-hole-pairs, and it gives an overview of the best approximation schemes for each regime. A detailed discussion of the carrier states in quantum dots is presented, including variational calculations, a configuration interaction approach, and quantum Monte Carlo techniques. Surface polarization instabilities are analyzed which lead to the self-trapping of carriers near the surface of the dots and the influence of spin-orbit coupling on the quantum-confined carrier states is discussed.The linear and nonlinear optical properties of small and large quantum dots are analyzed in detail, including transient optical nonlinearities (photon echo) and two-photon transitions. The influence of the quantum-dot size distribution in many realistic samples is outlined, including the analysis of quantum dot growth laws and universal size distributions. Phonons in quantum dots, as well as the influence of external electric or magnetic fields are discussed. The recent developments dealing with regular systems of quantum dots are reviewed, including a lattice model of quantum dots and quantum dot superlattices. ... Read more

Product Description
Understanding semiconductor devices, as the building blocks of electronic circuits, is clearly of fundamental importance. In response to this challenge, this text, suitable for an advanced undergraduate or early graduate level course, is written to achieve the following goals: 1.)To meet the students' need to understand with: a)intuitive explanations of the underlying scientific concepts, b)explained fundamental equations, as opposed to using mathematics to explain physical phenomena, c)explained energy-band diagrams to provide rigorous and powerful presentations, which are easy to understand through an analogy with balls on a solid surface and bubbles in water, d)intriguing review questions, and a comprehensive set of worked out examples and problems. 2.)To provide a vertical (electronics-to-physics) hierarchy and a lateral (in terms of contents) flexibility. The electronics-to-physics approach motivates the students to learn the underlying scientific concepts and mathematical models by providing appropriate context and a continuous progression from the common-sense towards more abstract concepts. 3.)To provide CAD "nuts and bolts" with a small SPICE simulator widely used for computer-aided design of electronic circuits. The SPICE contents of this book provide a unique reference and pedagogical tools including: a)tabular presentations of the equations used as device models, b)hierarchically classified and explained SPICE parameters, c)case by case description of parameter measurement techniques, d)computer-based exercises that illustrate the effects of individual SPICE parameters on device and circuits characteristics. 4.)To provide links between the theoretical principles and real-life issues. The following points illustrate the level of integration achieved in this book: a)The device descriptions develop from application concepts (basic circuits). The underlying scientific concepts are "discovered" as needed. The introductions of particular device effects are explained by directly linked descriptions of what is happening on an atomic scale, b)Direct links are established between the fundamental equations and pragmatic SPICE models, c)Practically important issues such as reliability, device parameter measurements, etc., are presented such that they are directly related to the descriptions of fundamental device electronics and technology. ... Read more

Customer Reviews (3)

The Clearest and greatest book to UNDERSTAND SEMICONDUCTOR DEVICES
This book is excelent. Every concept is clearly explained, pictures support every argument (I want to enphasise this: amazing). I have read many books about semiconductors, and again this ones clarified just everything...The understanding that you get about Semiconductors through this book is just amazing. Very helpful for beginers and even better when you need to review some concepts that were poorly explained or badly learned in the past.

Just excelent

Juan

Very Understandable
As a graduate student going through the book by myself I found the content really useful as well as very understandable.I would highly recommend this book to anyone wishing to learn more about the basic as well as the more complex principles of semiconductor devices.

Excellent...YES!
I have been using this book for my Electric Devices course.It is a really, really good book.I would very much recommend it to any professors to use it as their textbook for their class.It explains concepts very clearly, and easy to understand.

A+ to the author! ... Read more

Product Description
This text is intended to teach the fundamentals of physics to computer scientists, electrical engineers, and others interested in electronics. The presentation is thus directed toward understanding the fundamental physics of how a computer works, while still providing a broad and effective one-year introduction to classical and modern physics. The first half of the book includes many of the topics of a standard introductory physics course, but with the selection and presentation tailored to be of use in the second half, which develops the physics of semiconductor devices. This second part covers the fundamentals of quantum mechanics, solid-state physics, crystal structure, semiconductor devices, and logic circuits. The mathematical complexities are alleviated by intuitive physical arguments. Students are encouraged to use their own programming skills to solve problems. Some knowledge of calculus is a prerequisite, and the second part can serve by itself as an introduction to the physics of electronic materials and devices for students who have had a standard two-semester introductory physics course.In this second edition, the material on electronic devices has been updated and the coverage of carrier transport, operation of bipolar transistors and MOSFETs, and fabrication of integrated circuits has been expanded. New material includes descriptions of the fundamentals of solar cells, dynamic random-access memories, charged-coupled-device imaging arrays, and of such compound semiconductor devices as light-emitting diodes and heterostructure lasers. ... Read more

Customer Reviews (1)

Too short and not enough info
This book does not elaborate the topics . It is very short and not enough info to gain knowledge. So I am looking for a good study guide for this book, it might help. ... Read more

Product Description
This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. ... Read more

Customer Reviews (1)

Extremely Comprehensive
This book provides an excellent overview of all aspects of semiconductor manufacturing.Many books on semiconductor processing focus on the "front end" processing: ion implantation, lithography, thin film deposition and so on.These are, of course, critical steps in manufacturing integrated circuits, but there are many other aspects as well, such as metrology, clean room management, particles, yield management, material handling, and waste management.This is the only book I am aware of that covers everything.As the author of the CVD chapter, I may not be 100% objective, but I have found this handbook to be a great reference.

The downside of such a comprehensive book is it can not go into each topic in great depth.And because many authors contributed, there is some unevenness from chapter to chapter.But overall, this is an excellent resource for people who need to understand modern techniques of semiconductor manufacturing. ... Read more

Product Description
For decades the semiconductor industry has been a driver of global economic growth and social change. Semiconductors, particularly the microchips essential to most electronic devices, have transformed computing, communications, entertainment, and industry. In Chips and Change, Clair Brown and Greg Linden trace the industry over more than twenty years through eight technical and competitive crises that forced it to adapt in order to continue its exponential rate of improved chip performance. The industry's changes have in turn shifted the basis on which firms hold or gain global competitive advantage.

These eight interrelated crises do not have tidy beginnings and ends. Most, in fact, are still ongoing, often in altered form. The U.S. semiconductor industry's fear that it would be overtaken by Japan in the 1980s, for example, foreshadows current concerns over the new global competitors China and India. The intersecting crises of rising costs for both design and manufacturing are compounded by consumer pressure for lower prices. Other crises discussed in the book include the industry's steady march toward the limits of physics, the fierce competition that keeps its profits modest even as development costs soar, and the global search for engineering talent.

Other high-tech industries face crises of their own, and the semiconductor industry has much to teach about how industries are transformed in response to such powerful forces as technological change, shifting product markets, and globalization. Chips and Change also offers insights into how chip firms have developed, defended, and, in some cases, lost global competitive advantage. ... Read more

Customer Reviews (4)

A Solid, Thoughtful Analysis of an Industry In Constant Turmoil
Semiconductor folks are all very familiar with the eight crises that the authors describe as reshaping the industry (rising design costs, rising fab costs, challenges and limits to Moore's Law, globalization, outsourcing, etc.).But they will appreciate the well-written and thoughtful analysis that describes the last 20 years of change, challenge, progress, and uncertainty.There is a clear appreciation of the great story that marks the rise of TSMC and fabless chip companies, the relentless pace set by Moore's Law, the global fireworks of national competition, and the ebb and flow of high tech careers.Some very sophisticated and original public policy and workforce insights.

Excellent book on an industry analysis from economist's point of view
This is a great book about the evolution of the semiconductor industry and its development cycles. Brown and Linden prvide fresh insights about the global competitiveness of America. This is an easy read, yet is based on statistics and scientif findings.

Timely and Accessible
Brown and Linden provide an insightful economic history of a turbulent industry that shapes much of our daily lives.Their primer on semiconductors was useful and concise.You will come away with a new respect for the toil, risk, and resilience that characterize the chip industry.

An Outstanding Study of Strategy and Change
"Chips and Change" provides an excellent overview of the rapidly changing strategic environment in the semiconductor industry, and some sense of where things are headed. Since the 1960s the semiconductor industry has been a driver of global economic growth and social change. Each country involved wants a large, viable semiconductor industry that provides good jobs. The authors use eight technical and managerial crises going back to the mid-1980s to examine the industry from an economic perspective, helping readers understand how global competitive advantage can be won and lost. None of the crises are permanently resolve, invariably rebuilding, often in a new guise (eg. fear of Japan re-emerges as fear of China).

In the first crisis, Japanese chip producers raised their share of industry revenues above U.S. producers by the mid-1980s by improving their manufacturing technology thanks to government demanding technology transfers from IBM etc. wanting access to growing Japanese markets, and lower capital costs. Their government also subsidized R&D, promoted cooperation between competitive groups, and protected Japanese markets. Japanese yields (70 - 80%) exceeded U.S. (50 - 60%), and reliability was also higher. American responses included Motorola's Six Sigma program to dramatically improve quality, U.C. Berkeley's establishing best-practice comparative performance benchmarks and the fall of "not-invented-here" attitudes in the industry, lowering the value of the dollar 51% vs. the yen, establishing a research consortium (SEMATECH) that helped chip-makers and suppliers work more closely together, and largely exiting the DRAM memory business due to overcapacity.

Intel also ended its "second-sourcing" agreements with other chip-makers, limiting competition, established the principal that the software embedded in the design (microcode) is copyrightable and began challenging threats to its intellectual property, sped up its product development cycle, and began branding its products. Motorola, IBM, and TI waited to exit the market until '97-'98, with only Micron remaining (cut its costs through design). Japan, in turn, lost its DRAM leadership to Korea's Samsung with its greater access to capital, and was further hindered by an overemphasis on quality while the market shifted from long-term mainframe uses to shorter-lived PCs and other consumer goods.

Increasing wafer size and decreasing line-width (from two microns in 1980, to .035 micron in 2009 - human hairs are about 100 microns) led to rapidly rising fabrication plant costs - the second crisis reviewed. Costs to build a leading-edge fabrication plant rose from $200 million in 1983 to $5-7 billion by 2007. Costs of developing the process flow also rose - to $2.5 billion. Consolidation was an obvious response, as was the development of independent Asian contract manufacturers that produced chips for other firms. This, in turn, has led to concern over ultimately losing fabrication (and design) skills in the U.S.

The third crisis was the inability to design chips that took advantage of the large number of circuits available through new fabrication plants. This was resolved through system-level integration onto a single chip, thus bringing faster operating speeds, lower power consumption, lower costs, the ability to be used in smaller consumer products, and improved reliability. At the same time, the required software (45% of design cost) rose to over 200 person-years for design and test. This led to the reliance on design automation and reusable code cores. Lowering the cost of design to meet consumer end-product requirements (the market moved from mainly PCs to also include cell-phones, etc.) also led to opening design centers in Asia (especially India), and 24-hour design work through passing the work back and forth between India and the U.S. over the Internet.

Particularly interesting was the authors' pointing out that cost savings via Asian engineering are not as dramatic as appear - only 25-50% savings, vs. the 80-90% that would appear via salary comparisons. Engineers in China and India, and to a lesser extent Taiwan, are younger with less experience and often only two-year degrees. They also often don't get trained on automated chip design. On the other hand, based on Samsung's experience in taking only ten years to move up the DRAM memory technology chain beginning in 1981, the authors envision Asian engineer parity with the U.S. in 10+ years. Meanwhile, the number of U.S. chip engineers has stagnated/fallen, and may already have been overtaken by those in Asia.

A related concern is that outsourcing leading-edge fabrication plants to Asia and Europe will lead to outsourcing chip design as well. The authors sort of go round in circles on this issue, eventually concluding that this negative outcome is likely.

One final challenge: The authors see current consumer-product chips as over-designed - more functions than most users want. Thus, the next trend will be simplifying those chips for use by poorer populations. ... Read more

Product Description

Fundamentals of III-V Semiconductor MOSFETs presents the fundamentals and current status of research of compound semiconductor metal-oxide-semiconductor field-effect transistors (MOSFETs) that are envisioned as a future replacement of silicon in digital circuits. The material covered begins with a review of specific properties of III-V semiconductors and available technologies making them attractive to MOSFET technology, such as band-engineered heterostructures, effect of strain, nanoscale control during epitaxial growth. Due to the lack of thermodynamically stable native oxides on III-V's (such as SiO₂ on Si), high-k oxides are the natural choice of dielectrics for III-V MOSFETs. The key challenge of the III-V MOSFET technology is a high-quality, thermodynamically stable gate dielectric that passivates the interface states, similar to SiO₂ on Si. Several chapters give a detailed description of materials science and electronic behavior of various dielectrics and related interfaces, as well as physics of fabricated devices and MOSFET fabrication technologies. Topics also include recent progress and understanding of various materials systems; specific issues for electrical measurement of gate stacks and FETs with low and wide bandgap channels and high interface trap density; possible paths of integration of different semiconductor materials on Si platform.

Customer Reviews (1)

No MOS On This Rock
This book was a great introduction to the growing body of literature and research implementing III-V Compound Semiconductor technology in MOS, Metal Oxide Semiconducto Fied Effect Transistors. I appreciated the depth of coverage, yet the editors took time to lay a strong historical foundation for the material before revealing the current stat of the art. ... Read more

Product Description
Provides an overview of a complete collection of semiconductor devices.
* Presents self-contained data on over 180 device variations.
* Suitable for a wide variety of audiences--from students to practitioners to laypeople. ... Read more

Customer Reviews (1)

comparable to Sze's book
The book should not be considered a listing of current major semiconductor devices currently for sale. Instead, it describes the theory behind the major types of devices - like a floating gate MOSFET, LED, injection laser, phototransistor, MIM diode.

Also, it explains quantum tunnelling - Fowler-Nordheim and the use of the Wentzel-Kramers-Brillouin approximation for the transmission coefficient. Tunnelling is used in various devices, and the understanding given here will be perfectly adequate for many researchers.

Only about 2 years of undergraduate physics is needed as preparation for the book. Plus some electrical engineering.

The text should be compared to the classic Sze tome, Physics of Semiconductor Devices. ... Read more

Product Description
Numerical analysis and simulation has become a basic methodology in device research and development. This text gives a thorough review and judgement of the various physical and mathematical models which are in use all over the world today. A compact and critical reference with many citations is provided, it is particularly relevant to authors of device simulation programs. The book provides a very detailed treatment of the state-of-the-art and highly specialized numerical methods for device simulation servers in an hierarchical manner, both as an introduction for newcomers and a worthwhile reference for the experienced reader. ... Read more

Customer Reviews (2)

Good Starting Point for Building a Foundation
Though 20 years old, or "lacking modern ... issues" as the previous reviewer said, this book presents the fundamental material of semiconductor device modeling in a logical and organized way.Though recent developments are not covered in this book, the fundamentals of how to discretize a PDE (i.e., poisson eqn, continuity eqs, etc) using finite difference methods, etc., don't change, and this book is a good starter for learning that.If you want to understand the concepts behind device simulators like DESSIS, MEDICI, PISCES, etc., this is a good place to start.

I'd give it 5 stars if it was written in the later 90's, and therefore had up to date info on mobility and recombination models, etc, and more on the hydrodynamic formulations.

Great starter for those into device modeling
I have often referenced this book for due to the nature of my graduate research.It is a good introduction to the finer points of semiconductor device modeling.(The stuff not really emphasized at the undergraduate level)However, this book is lacking with respect to many modern device structures and issues.(e. g. power transistors, HEMT's, III-V compound information)I still recommend it as reference material. ... Read more

Product Description

This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems.

Product Description
Learn the latest advances in SiC (Silicon Carbide) technology from the leading experts in the field with this new cutting-edge resource. The book is your single source for in-depth information on both SiC device fabrication and system-level applications. This comprehensive reference begins with an examination of how SiC is grown and how defects in SiC growth can affect working devices.

Key issues in selective doping of SiC via ion implantation are covered with special focus on implant conditions and electrical activation of implants. SiC applications discussed include chemical sensors, motor-control components, high-temperature gas sensors, and high-temperature electronics. By cutting through the arcane data and jargon surrounding the hype on SiC, this book gives an honest assessment of today’s SiC technology and shows you how SiC can be adopted in developing tomorrow’s applications. ... Read more